摘要 |
<p>The method involves melting the plastic surface area by the coupling of ultrasonic energy. The microstructures (6) on the sonotrode (2) surface areas, on the anvil (4) surface area or for double-sided structuring of the plastic substrate are located on both the surfaces. The plastic substrate (5) is placed between the sonotrode and the anvil, where the sonotrode is pressed with a defined frequency, with a defined pressure and in a defined time in the direction of the anvil, till the plastic substrate is plastically deformed by heat generation. An independent claim is included for a device for embossing microstructures in flat thermoplastic plastic semi-finished products, such as plates or films.</p> |