| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component which includes a semiconductor device mounted on a circuit board and which effectively reduces a stress applied from the circuit board to the semiconductor device while keeping a contact connection between the circuit board and the semiconductor device, and to provide a method of manufacturing the electronic component. <P>SOLUTION: The electronic component includes a circuit board 30 having connection electrodes 32 formed thereon, a semiconductor device 10 formed above the circuit board 30 to be electrically connected to the connection electrodes 32 via projected resilient terminals 22, and a structure 42 formed to cover the semiconductor device 10 and fixed to the circuit board 30. The semiconductor device 10 is held between the projected terminals 22 and the structure 42 by the elastic force of the projected terminals 22. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
