| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide the division method of an adhesive wafer for easily dividing a wafer configured by adhering a protection wafer on the surface. <P>SOLUTION: This method for dividing an adhesive wafer for dividing an adhesive wafer 14 configured by adhering a protection wafer 12 on the surface of a device wafer 2 following a division scheduled line 4 includes: a process for irradiating the protection wafer with a laser beam with wavelength having transparency following a division scheduled line, and for forming a first transformation layer 32 with two strips following the division scheduled line inside the protection wafer; a process for irradiating the device wafer with the laser beam with wavelength having transparency following the division scheduled line by avoiding the electrode of the device wafer at a position corresponding to the intermediate of the first transformation layer with two strips formed inside the protection wafer, and for forming a second transformation layer 34 inside the protection wafer; and a division process for dividing the adhesive wafer into individual chips following the first and second transformation layers by applying an external force to the wafer. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
