发明名称 LASER MACHINING APPARATUS AND POSITION DETECTING METHOD OF THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To use various kinds of laser beams, such as a visible laser beam, without limiting the wavelength of a laser beam emitted from a distance sensor, and to further perform detection work simultaneously with laser machining. <P>SOLUTION: A laser machining head 14, which constitutes a laser machining apparatus 10, includes: a machining-laser irradiation mechanism 22, which conducts laser machining by irradiating a workpiece W with a machining-laser beam L; and a position detecting mechanism 24, which detects the position of the laser machining head 14 relative to the workpiece W. The machining-laser irradiation mechanism 22 includes: a lens 30, which adjusts the condensing distance of the machining-laser beam L; and a scanning-laser mirror 34, which is arranged in the downstream from the lens 30 and irradiates the workpiece W by scanning the machining-laser beam L. The position detecting mechanism 24 includes a distance sensor 36 for introducing a measuring-laser beam L0, which is scanned by the scanning-laser mirror 34 without passing through the lens 30 and applied to the workpiece W coaxially with the machining-laser beam L. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010099679(A) 申请公布日期 2010.05.06
申请号 JP20080272002 申请日期 2008.10.22
申请人 HONDA MOTOR CO LTD 发明人 OKUBO SATOSHI;ODA KOJI
分类号 B23K26/04 主分类号 B23K26/04
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