发明名称 LOW-TEMPERATURE CURABLE CONDUCTIVE PASTE FOR PLATING AND ELECTRIC WIRING USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a conductive paste that is excellent in low-temperature curability, platability, and printability and to form an excellent circuit by being applied with plating, and an electric wiring using the same. SOLUTION: The conductive paste contains conductive powder (A), vinyl chloride-vinyl acetate resin (B), polyester resin and/or a polyurethane resin (C), a blocked isocyanate (D) blocked with an active methylene compound, and an organic solvent (E). The resin (C) has a glass transition temperature of≥-50°C and≤20°C. A total amount of the resin (C) is 50-400 pts.wt. per 100 pts.wt. of the resin (B) while a total amount of the resin (B), the resin (C) component, and the blocked isocyanate (D) is 10-60 pts.wt. per 100 pts.wt. of the conductive powder (A). An electric wiring is configured such that the conductive paste is formed on an insulating substrate. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010102988(A) 申请公布日期 2010.05.06
申请号 JP20080274230 申请日期 2008.10.24
申请人 TOYOBO CO LTD;TOSHIBA CORP 发明人 AKIBA YUICHIRO;HONDA TOMOKO;TAKAHASHI FUJIO;NAKADA SHINJI
分类号 H01B1/22;H01B1/00;H01B5/14;H01B13/00;H01Q1/38;H05K1/09;H05K3/12;H05K3/24 主分类号 H01B1/22
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