| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting method which has high joint reliability and productivity for laser soldering of a leadless electronic component with high heat resistance without breaking the component with heat applied during mounting. SOLUTION: Solder 3 is supplied to a land 2 of a printed circuit board 1 to solder a bottom terminal portion 5 and a side terminal portion 6 of the leadless electronic component 4 to the land 2. While being adjacent to the land 2 of the printed circuit board 1, a through-hole 7 is bored opposite the bottom terminal portion 5 of the leadless electronic component 4, and preheating is carried out from the through-hole 7 with a hot blast. An irradiation time of laser light is shortened by the preheating, and wettability of the bottom terminal portion 5 is improved to enhance the joint reliability. COPYRIGHT: (C)2010,JPO&INPIT |
