发明名称 CHARGED PARTICLE BEAM APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a charged particle beam apparatus improved in inspection accuracy corresponding to the pattern refining of an inspection object while being compact and reduced in cost. SOLUTION: The inspection position (a wafer coordinate system) of an inspected sample is converted into an arranged position (a stage coordinate system (a polar coordinate system)) of an inspection mechanism. A rotating arm 102 is rotated, and a rotary stage 103 is rotated to move the inspection position of the inspected sample into the arranged position of the inspection mechanism. At this time, the deviation amount or the like of the center of the rotary stage 103 can be computed and corrected. The inspection accuracy can thereby be improved corresponding to the pattern refining of the inspected object in the charged particle beam apparatus having a biaxial rotary stage mechanism. Further, since a plurality of inspection devices are arranged on a moving locus of the center of the rotary stage 103 described by the rotation of the rotating arm 102, the charged particle beam apparatus capable of making multiple kinds of inspection while being compact can be achieved. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010102984(A) 申请公布日期 2010.05.06
申请号 JP20080273986 申请日期 2008.10.24
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 YANO MANABU;ITO HIROYUKI;ISHII RYOICHI;OTAKA TADASHI;KAWANO HAJIME
分类号 H01J37/20;H01L21/66 主分类号 H01J37/20
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