| 摘要 |
PROBLEM TO BE SOLVED: To provide a silicon-containing curable composition which eliminates cissing to have sufficient adhesion even to a polyimide resins and is suitably used as an electric or electronic material, particularly as a sealing medium for luminous elements. SOLUTION: The silicon-containing curable composition contains: a compound (H-2) having two or more Si-H groups in the molecule, obtained by the hydrosilylation of a compound (V-1) represented by formula (1) (wherein R<SP>1</SP>is a 2-10C organic group having a carbon-carbon double bond having reactivity with an Si-H group and R<SP>2</SP>is a 1-10C organic group) and a compound (H-1) having two or more Si-H groups in the molecule; a prepolymer (V-3) having two or more carbon-carbon double bonds having reactivity with an Si-H group in the molecule, obtained by the hydrosilylation of a cyclic siloxane compound (V-2) having two or more carbon-carbon double bonds reactive with an Si-H group in the molecule and/or the compound (V-2) and a compound (H-3) having two or more Si-H groups in the molecule; and a hydrosilylation catalyst. COPYRIGHT: (C)2010,JPO&INPIT
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