发明名称 |
METHOD OF ASSEMBLY OF A SEMICONDUCTOR PACKAGE FOR THE IMPROVEMENT OF THE ELECTRICAL TESTING YIELD ON THE PACKAGES SO OBTAINED |
摘要 |
A method of assembly of a semiconductor package includes treating the electrical contacts thereof by the application on the electrical contacts of a chemical composition comprising at least one ionic polar surfactant. A semiconductor package has a coating on the electrical contacts thereof, the coating comprising at least one ionic polar surfactant. A device includes a semiconductor package with electrical contacts on a circuit board, the electrical contacts having a coating that includes an ionic surfactant.
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申请公布号 |
US2010109150(A1) |
申请公布日期 |
2010.05.06 |
申请号 |
US20080261841 |
申请日期 |
2008.10.30 |
申请人 |
STMICROELECTRONICS (MALTA) LTD. |
发明人 |
CARUANA ROBERT;BORG ADRIAN-MICHAEL;GAUCI JOSEPH |
分类号 |
H01L21/60;H01L23/498 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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