| 摘要 |
Method and apparatus for constructing and operating a high bandwidth package in an electronic device, such as a data storage device. In some embodiments, a high bandwidth package comprises a first known good die that has channel functions, a second known good die that has a controller function, and a third known good die that has a buffer function. Further in some embodiments, the high bandwidth package has pins that connect to each of the first, second, and third dies.
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