| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting substrate for electronic parts in a simple configuration, which is capable of coping with both wire bonding connection and flip-chip connection. <P>SOLUTION: In the mounting substrate 10 for electronic parts, a second wiring portion 16 is connected to a first electrode pad 13 and a second electrode pad 14 which have a reverse position relationship in the front-rear direction of a substrate 11. For this reason, even if the mounting surface 2a of an electronic part 1 is reversed in relation to the mounting substrate 10 in two cases where a connection is made by wire bonding and the connection is made by flip-chip bonding, it is possible to cope with a terminal electrode 3 on the side of the electronic part 1 and with an external electrode 12 on the side of the mounting substrate 10 in the same manner, without making changes in the arrangement of the terminal electrode 3 on the side of an electronic part 1 and that of the external electrode 12 on the side of the mounting substrate 10. Furthermore, the foregoing configuration can be realized by patterning a second wiring portion 16, and therefore the change in neither the substrate 11 nor the external electrode 12 is necessary. As a result, the complexity of the configuration can be avoided. <P>COPYRIGHT: (C)2010,JPO&INPIT |
