发明名称 SUBSTRATE FOR MOUNTING LIGHT-EMITTING ELEMENT, LIGHT-EMITTING ELEMENT PACKAGE, AND METHOD OF MANUFACTURING THE SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate for mounting a light-emitting element, which can form a power supply part by simple treatment without carrying out plating treatment or etching treatment. <P>SOLUTION: The method of manufacturing the substrate for mounting the light-emitting element includes: a step of forming a projecting part A on the surface formed by laminating and integrating an insulating resin material and metal foil on a metal substrate 10 on which a columnar metal body 14 is provided; a step of exposing the columnar metal body 14 by removing the projecting part A; and a step of cutting the periphery of the exposed columnar metal body 14 so that the metal foil around the metal body parts is divided. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010103172(A) 申请公布日期 2010.05.06
申请号 JP20080271179 申请日期 2008.10.21
申请人 DENKA AGSP KK 发明人 YOSHIMURA EIJI
分类号 H01L33/48 主分类号 H01L33/48
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