发明名称 EPOXY-BASED RESIN COMPOSITION, SHEET-LIKE MOLDED PRODUCT, PREPREG, CURED PRODUCT, LAMINATED PLATE, AND MULTILAYER LAMINATED PLATE
摘要 PROBLEM TO BE SOLVED: To provide an epoxy-based resin composition which allows surface roughness of a roughening treated surface of the cured product to be reduced, glass transition temperature of the cured product to be heightened, and coefficient of linear expansion of the cured product to be reduced even when a content of an inorganic material is low, and to provide a cured product thereof. SOLUTION: The epoxy-based resin composition contains an epoxy-based resin, a curing agent, silica, and a maleimide-based compound, wherein the maleimide-based compound is contained in the range of 2-200 pts.wt. based on 100 pts.wt. of the sum total of the epoxy-based resin and the curing agent, and the silica is contained in the range of 5-50 wt.% in the solid content of 100 wt.% in the epoxy-based resin composition. The cured product 1 is formed by heating and preliminarily curing the epoxy-based resin composition, and subsequently conducting roughening treatment thereof. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010100802(A) 申请公布日期 2010.05.06
申请号 JP20090042776 申请日期 2009.02.25
申请人 SEKISUI CHEM CO LTD 发明人 MURAKAMI JUNNOSUKE;GOTO NOBUHIRO;HEIJI KATSU
分类号 C08L63/00;B32B15/08;B32B15/092;C08J5/24;C08K3/36;C08K5/13;C08K5/3415 主分类号 C08L63/00
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