| 摘要 |
A system and method for providing the capability of peeling thin polymer films from a substrate is provided. Generally, the method contains the steps of: providing a substrate having a top surface and a bottom surface; placing a peel initiator on the top surface; applying a polymer on the top surface of the substrate and a top surface of the peel initiator; curing the polymer, resulting in a thin-polymer film; and peeling the peel initiator from the substrate, thereby removing the thin-polymer film from the top surface of the substrate.
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