发明名称 RESIN MOLDING APPARATUS AND RESIN MOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a resin molding apparatus and a resin molding method which can selectively heat a thermoplastic resin in a mold as compared with a rubber-made mold and make a heating temperature in each part of the thermoplastic resin uniform. SOLUTION: The resin molding apparatus 1 includes the rubber-made mold 6, a light source 2 emitting light including a 0.78-2 μm wavelength domain, and a reflector 3 comprised of a large number of reflecting surfaces 31. The resin molding apparatus 1 heats the thermoplastic resin 8 in the mold 6, when the light source 2 and the reflector 3 are fixed, and light is distributed to a target irradiation position G and when a range in which a light reflection axis by the reflection of each reflecting surface 31 reaches the target irradiation position G is made an irradiation range E, by changing the irradiation range E to draw a circle around the center of the target irradiation position G by rotating the light source 2 and the reflector 3 integratedly. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010099860(A) 申请公布日期 2010.05.06
申请号 JP20080271245 申请日期 2008.10.21
申请人 TECHNO POLYMER CO LTD;NIPPON REKKUSU KK 发明人 KURIHARA FUMIO;TAKAMI MASAMITSU
分类号 B29C33/06;B29C35/08 主分类号 B29C33/06
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