| 摘要 |
<P>PROBLEM TO BE SOLVED: To dissipate heat generated from a heat generation component to the outside, to reduce stress applied to the heat generation component, to easily cope with a change in the layout of components on a printed circuit board, and to reduce a request level of dimension precision to each component in an electronic control device. Ž<P>SOLUTION: The electronic control device includes: the printed circuit board 2 to which heat generation components 3 are packaged; and a casing 4 for storing the printed circuit board 2. The electronic control device has a heat transfer pin 5 that is erected on the printed circuit board 2 and allows at least one end to be connected to the casing 4, and transfers heat that is transferred from the heat generation component 3 to the printed circuit board 2 from the printed circuit board 2 to the casing 4. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
