| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a through electrode substrate that suppresses generation of voids in a conduction portion. SOLUTION: A through-hole 102 is formed that penetrates a substrate 101. An insulation film 103 is formed on the surface of the substrate 101 and the inner wall of the through-hole 102. Then, a blocking member is arranged so as to close at least one opening of the through-hole 102. A seed layer is formed on the substrate 101 at the side where the blocking member is arranged. The blocking member is removed. A conductive material is filled in the through-hole 102 by an electrolytic plating method for supplying electric power to the seed layer, and a conductive portion 105 is formed. COPYRIGHT: (C)2010,JPO&INPIT |
