| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead-free low-melting point glass composition which is hardly crystallized and is stable upon high temperature, with respect to a low-melting point glass required as adhesion and sealing material of electronic parts or as covering material for protection or insulation of electrode or resister formed on the electronic parts. SOLUTION: This V<SB>2</SB>O<SB>5</SB>-P<SB>2</SB>O<SB>5</SB>-based lead-free low-melting point glass comprises V<SB>2</SB>O<SB>5</SB>of 45 to 85 mass% and P<SB>2</SB>O<SB>5</SB>of 8 to 30 mass%. Such the lead-free low-melting point glass has a thermal expansion coefficient at 30°C to 200°C, of (60 to 100)×10<SP>-7</SP>/°C and has a softening point of 280°C to 400°C. COPYRIGHT: (C)2010,JPO&INPIT |
