OPTICAL ELEMENT WAFER AND METHOD FOR MANUFACTURINGTHE SAME, OPTICAL ELEMENT, OPTICAL ELEMENT MODULE, ELECTRONIC ELEMENT WAFER MODULE, ELECTRONIC ELEMENT MODULE, AND ELECTRONIC INFORMATION DEVICE

摘要

PROBLEM TO BE SOLVED: To accurately form a resin replica to accurately form the upper and lower stamper molds, and to solve the problem of strength issue in forming a large-sized lens wafer, and further to solve the problem of residual air bubbles.

SOLUTION: A portion or all of the side surface of the resin replica 14 is buried in a plurality of recesses 11a carved in base material 11 to form the resin replica 14. Therefore, the contacting area of the base material 11 and the resin replica 14 is larger than the contacting area of the resin replica 14 and a master mold 13, and the contacting area of the base material 11 and the resin replica 14 is larger than the contacting area of the resin replica 14 and the stamper molds 15 and 16. Thus, the release of the master mold 13 and the stamper molds 15 and 16 can be performed smoothly, and the thickness of a connecting portion 4 between flat portions 3 becomes thicker by an amount of equivalent to the depth of the recesses 11a.

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