THIN-FILM PIEZOELECTRIC MATERIAL ELEMENT AND METHOD OF MANUFACTURING THE SAME, HEAD GIMBAL ASSEMBLY USING THE SAME, AND HARD DISK DRIVE USING THE HEAD GIMBAL ASSEMBLY

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a thin-film piezoelectric material element which can be made high in performance and reliability and low in cost.

SOLUTION: The method of manufacturing the thin-film piezoelectric material element includes the stages of: forming a laminate L by stacking a first electrode film 45, a piezoelectric material film 43, and a second electrode film 41 on a first substrate S1; forming a laminate M by stacking a support film 48 on a second substrate S2; sticking the laminate L and laminate M together with an adhesion film 47 such that the second electrode film 41 and support film 48 face each other so as to form a laminate P comprising the laminate L, adhesion film 47, and laminate M; removing the first substrate S1 from the laminate P; working the laminate P into a desired shape after the stage of removing the first substrate S1; and removing the second substrate S2 after the stage of working the laminate P. The adhesion film 47 has a lower Young's modulus than the piezoelectric material film 43, the second electrode film 41 and support film 48 have higher Young's moduli than the adhesion film 47, and the laminate P does not have a piezoelectric film except for the piezoelectric material film 43.

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