| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a heat sensitive flow rate sensor allowing a sensor chip free from stress from a support board under a condition of sealing a part of the sensor chip with a mold resin. <P>SOLUTION: A part of the sensor chip 20 is sealed with the mold resin 40 in the state of laminating an adhesive layer 52 of a heat peel seat 50 being laminated on one side 12 of the support board 10 and a heat peel layer 53 being laminated to a back side 23 of the sensor chip 20. Then the heat peel layer 53 of the heat peel seat 50 is peeled from the back side 23 of the sensor chip 20 by heating the heat peel seat 50. Stress is not transmitted thereby to the sensor chip 20 from the support board 10 through the heat peel seat 50 since the heat peel seat 50 contacts with neither of the sensor chip 20 and one side 12 of the support board 10. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
