发明名称 |
INTEGRATED ENCAPSULATION FOR MEMS DEVICES |
摘要 |
<p>In one general aspect, methods and articles of manufacture for creating micro- structures are disclosed. In one embodiment, the micro-structures are configured to provide a desired level of hermiticity to other micro-sized devices, such as MEMS and microfluidic devices. In one embodiment, the microstructures are formed from a single species of photoresist, where the photoresist is lithographically patterned to encapsulate the micro-sized device. In general, the ability to form an encapsulating micro-structure from a single photoresist relies in part on applying variable light doses to a later of photoresist to affect a desired level of cross-linking within the photoresist.</p> |
申请公布号 |
WO2010049813(A1) |
申请公布日期 |
2010.05.06 |
申请号 |
WO2009IB07414 |
申请日期 |
2009.10.28 |
申请人 |
UTI LIMITED PARTNERSHIP;ZINE-EL-ABIDINE, IMED;OKONIEWSKI, MICHAEL |
发明人 |
ZINE-EL-ABIDINE, IMED;OKONIEWSKI, MICHAEL |
分类号 |
B81C1/00;B81C99/00 |
主分类号 |
B81C1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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