| 摘要 |
<p>An apparatus for cleaning a surface of wafer (1010) or substrate includes a plate (1008) being positioned with a gap to surface of the wafer (1010) or substrate, and the plate (1008) being rotated around an axis vertical to surface of the wafer or substrate. The rotating plate surface facing surface of the wafer or substrate has grooves, regular patterns, and irregular patterns to enhance the cleaning efficiency. The apparatus further includes an ultra sonic or mega sonic transducer vibrating the rotating plate during cleaning process.</p> |
