| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic device, in which solder is disposed on a substrate, where wire bonding is carried out, using a strip mask, wherein residues of the strip mask being suitably reduced without plating a bonding land with Pd. <P>SOLUTION: A reduction member 110, which is easier to oxidize than base metal 12a of the bonding land 12 at curing temperature of the mask and solder reflow temperature, is added to the microstrip mask 100 used for a mask arranging step. <P>COPYRIGHT: (C)2010,JPO&INPIT |
