| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce stress generated at an end of solder joined to an electrode on an upper surface of a semiconductor chip as much as possible. <P>SOLUTION: The semiconductor device is provided with a projection 22 from a position on an upper surface of a first metal plate 13 which corresponds to an end of an electrode for soldering to a position corresponding to inside an end of a metal block 15, and the film thickness of solder 16 between an upper surface of the projection 22 and a lower surface of the semiconductor chip 12 is made less than the film thickness of solder 16 between the upper surface of the first metal plate 13 other than the projection 22 and the lower surface of the semiconductor chip 12, thereby reducing the stress generated at the end of the solder 16 joined to the electrode for soldering on the upper surface of the semiconductor chip 12 as much as possible. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
