| 摘要 |
PROBLEM TO BE SOLVED: To provide a support device stably supporting a wafer while avoiding its cracks and fall. SOLUTION: The support device 10 supports a plate-like member, such as a semiconductor wafer W. The support device 10 is provided with: a contact surface 11A in contact with the plate-like member W; an annular contact body 11 having a through hole 11B passing through the side of the contact surface 11A; a suction means 14 for giving suction force to the plate-like member W through the through hole 11B; a holding body 13 having a reception section 12 of the contact body 11; and a separation means 15 for enabling the contact surface 11A to project and retract to and from the reception section 12 and separating the plate-like member W supported by the contact body 11. COPYRIGHT: (C)2010,JPO&INPIT |
