发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor memory high in accuracy of widths of line and space. Ž<P>SOLUTION: The method of manufacturing the semiconductor memory includes steps of: forming a first pattern constituted of a silicon material film on a film to be worked; oxidizing both side surfaces and an upper surface of the first pattern to form a silicon oxide film and removing a part of the silicon oxide film formed on the upper surface to form a second pattern constituted of the silicon oxide films formed on both side surfaces; removing the first pattern to form a mask pattern constituted of the second pattern; and working the film to be worked, exposed from the mask pattern. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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申请公布号 |
JP2010103389(A) |
申请公布日期 |
2010.05.06 |
申请号 |
JP20080275130 |
申请日期 |
2008.10.27 |
申请人 |
TOSHIBA CORP |
发明人 |
IGUCHI SUNAO;BABA MASANOBU;TAKAHATA KAZUHIRO;NAKAJIMA FUMIHARU;MUKAI HIDEFUMI;EMA TATSUHIKO;KAWAI BURANDO;KADOTA KENICHI;KIKUTANI KEISUKE |
分类号 |
H01L21/8247;H01L27/115;H01L29/788;H01L29/792 |
主分类号 |
H01L21/8247 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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