| 发明名称 |
SEMICONDUCTOR MODULE INCLUDING CIRCUIT COMPONENT AND DIELECTRIC FILM, MANUFACTURING METHOD THEREOF, AND APPLICATION THEREOF |
| 摘要 |
Multiple semiconductor device components and passive device components fixed to a substrate are embedded within an electroconductive-film/insulating-resin-film structure, and are thermally bonded to an insulating resin film.
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| 申请公布号 |
US2010112760(A1) |
申请公布日期 |
2010.05.06 |
| 申请号 |
US20090603122 |
申请日期 |
2009.10.21 |
| 申请人 |
SANYO ELECTRIC CO., LTD. |
发明人 |
USUI RYOSUKE;INOUE YASUNORI |
| 分类号 |
H01L21/56;H01L21/60;H01L21/98;H01L23/31;H01L23/538;H01L25/16 |
主分类号 |
H01L21/56 |
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