SEMICONDUCTOR CHIP, METHOD OF MANUFACTURING A SEMICONDUCTOR CHIP, AND METHOD OF TESTING A SEMICONDUCTOR CHIP

摘要

Semiconductor chip (12) having a surface (4) provided with a first set of mutually similar first metal layer portions (6) that have a first width along the surface (4). The surface is further provided with a second set of mutually similar second metal layer portions (8) that have a second width along the surface (4). Each first metal layer portion (6) forms an external functional contact surface (14) of the semiconductor chip(12). Each second metal layer portion (8) forms an external test contact surface (16) of the semiconductor chip (12). The second width is substantially smaller than the first width.