| 摘要 |
A highly flexible semiconductor device of a stacked-type semiconductor device which transfers information by inductive coupling between inductors, in which LSI chips can be stacked even when a transmitter circuit and a receiver circuit are arranged at different positions from each other when viewed in a stacking direction. The semiconductor device has an interposer including a first inductor which is inductively coupled with a transmitter circuit of a first LSI chip to be stacked, and a second inductor which is inductively coupled with a receiver circuit of a second LSI chip to be stacked, the first inductor and the second inductor being electrically connected. An interchip communication is made from the first LSI chip to the second LSI chip. |
