TEST DEVICE, CIRCUIT MODULE, AND MANUFACTURING METHOD

摘要

Provided is a test device including: a test circuit arranged on a test substrate for testing a device to be tested; a sealing portion for covering a region of the test substrate where the test circuit is formed so as to seal the test circuit and define a sealed space filled with a cooling member; and a through connector arranged through the sealing portion for electrically connecting the test circuit to the element arranged outside the sealing portion without using the test substrate.