Lötverbindung und Verfahren zur Herstellung einer Lötverbindung

摘要

The arrangement uses a solder material that is introduced between the joint partners or parts. At least one joint partner (1) has a solder reservoir (3) opening near the contact surface (7), facing the contact surface and into which solder is introduced. The solder reservoir is fully bounded and enclosed by the contact surface. AN Independent claim is also included for the following: a method of making a solder joint between two elements with a common contact surface.