| 发明名称 |
ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE |
| 摘要 |
<p>The adhesive composition of the invention comprises a radical generator, a thermoplastic resin and a urethane (meth)acrylate having two or more radical-polymerizing groups in the molecule and a weight-average molecular weight of 3000-30,000.</p> |
| 申请公布号 |
EP1860170(A4) |
申请公布日期 |
2010.05.05 |
| 申请号 |
EP20060729113 |
申请日期 |
2006.03.15 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
KATOGI, SHIGEKI;IZAWA, HIROYUKI;SUTOU, HOUKO;YUSA, MASAMI;FUJINAWA, TOHRU |
| 分类号 |
C09J175/16;C09J4/00;C09J9/00;C09J201/00;H01B1/20;H01L21/60 |
主分类号 |
C09J175/16 |
| 代理机构 |
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