| 摘要 |
<p>A heating element device is provided with a heat dissipation case (2) made of metal having a first case plate (2a) and a second case plate (2b) which have peripheral edge portions (6, 9) air-tightly connected to each other. A plurality of ceramic semiconductor heating elements (14) are sandwiched between the both case plates (2a, 2b) through electrode plates (16) in between. An electricity supply path (4b) to each of the electrode plates (16) is disposed air-tightly to the inside of the heat dissipation case (2). Moreover, a hollow portion in the heat dissipation case (2) is maintained in a vacuum state so that an inner face (8) of the first case plate (2a) and an inner face (12) of the second case plate (2b) are always subjected to an attraction force in a direction in which they get closer to each other.</p> |
