发明名称 |
Light emitting device |
摘要 |
A light emitting device includes a package having a recess defined by an inner wall and a bottom surface and a lead terminal exposed at the bottom surface of the recess and protruded outward from the package. The lead terminal exposed at the bottom surface of the recess portion including a semiconductor light emitting element mounting region and a wire connecting region for connecting a conductive wire from the semiconductor light emitting element thereto. At least one of regions between the semiconductor light emitting element mounting region and the wire connecting region has a groove portion disposed in a position spaced apart from a peripheral edge portion of the lead terminal that is exposed at the bottom surface of the recess.
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申请公布号 |
US7709854(B2) |
申请公布日期 |
2010.05.04 |
申请号 |
US20070867240 |
申请日期 |
2007.10.04 |
申请人 |
NICHIA CORPORATION |
发明人 |
BANDO YOSHITAKA;NAKASHIMA SHINTARO;TAKAO TOSHIMASA |
分类号 |
H01L33/00;H01L33/28;H01L33/32;H01L33/48;H01L33/56;H01L33/62 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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