METHOD FOR PRODUCING OPTOELECTRONIC COMPONENTS, AND OPTOELECTRONIC COMPONENT

摘要

A method for producing optoelectronic components is specified, in which a plurality of semiconductor bodies (2) each having a semiconductor layer sequence are provided. A component carrier assemblage (30) having a plurality of connection pads (35) is also provided. The semiconductor bodies (2) are positioned relative to the component carrier assemblage (30). An electrically conductive connection is produced between the connection pads (35) and the associated semiconductor bodies (2), and the semiconductor bodies are fastened to the component carrier assemblage (30). The optoelectronic components (2) are completed, wherein a component carrier is formed for each optoelectronic component from the component carrier assemblage (30) on which the semiconductor bodies (2) are fastened. An optoelectronic component is also specified.