A SEMICONDUCTOR DEVICE INCLUDING A PROCESS MONITORING PATTERN OVERLAPPED WITH AN I/O PAD

摘要

PURPOSE: A semiconductor device including a process monitoring pattern overlapped with an I/O pad is provided to reduce possession area of a semiconductor chip on a wafer by forming a process monitoring pattern to be overlapped on an I/O pad area. CONSTITUTION: A semiconductor substrate(5) has the cell region and peripheral circuit region. The process monitoring pattern(MP) is formed in the peripheral circuit region. An input-output pad(120) is formed in the process monitoring pattern image. Process monitoring patterns and input-output pads are perpendicularly overlapped. Process monitoring patterns comprises the first process monitoring pattern including the semiconductor substrate and the first oxide(15) pattern.