发明名称 Bonded body, wafer support member using the same, and wafer treatment method
摘要 A bonded body consisting of a ceramic member and a metal composite member of which bonding layer is less likely to be eroded by plasma is provided. The bonded body comprises the ceramic member that has two opposing main surfaces with a first metal layer provided on one of the main surfaces, the metal composite member that has two opposing main surfaces with a second metal layer provided on one of the main surfaces, and a brazing material layer that joins the first metal layer and the second metal layer, wherein the brazing material layer has an outer circumferential surface that has a depression formed therein at middle position in the direction of thickness thereof, with the depression having width at least one third the thickness of the brazing material layer.
申请公布号 US7709099(B2) 申请公布日期 2010.05.04
申请号 US20060479935 申请日期 2006.06.29
申请人 KYOCERA CORPORATION 发明人 YOKOYAMA KIYOSHI
分类号 H01L21/306;H01L21/302 主分类号 H01L21/306
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