发明名称 Socket assembly with backplane
摘要 A socket assembly mounted on a printed circuit board comprises a socket mounted upon the printed circuit board; a metal backplane, mounted below the printed circuit board and configured with a board-like shape; and an insulative sheet. The insulative sheet is sandwiched between the printed circuit board and the metal backplane and is formed with at least one latching portion extending downwardly to latch the metal backplane. The insulative sheet further has a plurality of protruding portions extending upwardly to insert into corresponding circular holes defined on of the printed circuit board.
申请公布号 US7708579(B2) 申请公布日期 2010.05.04
申请号 US20090380870 申请日期 2009.03.03
申请人 HON HAI PRECISION IND. CO., LTD. 发明人 YEH CHENG-CHI
分类号 H01R13/62 主分类号 H01R13/62
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