摘要 |
<p>This invention provides a pressure sensitive adhesive double coated sheet (100) for electronic components. The pressure sensitive adhesive double coated sheet (100) comprises a pressure sensitive adhesive layer (3), a first release sheet (1) applied onto one side of the pressure sensitive adhesive layer (3), and a second release sheet (2) applied onto the other side of the pressure sensitive adhesive layer (3). The first release sheet (1) comprises a first release agent layer (11) composed mainly of an olefinic resin. The second release sheet (2) comprises a second release agent layer (21) composed mainly of a diene polymer material. The pressure sensitive adhesive double coated sheet (100) is characterized in that it satisfies a relationship represented by Y-X >= 50, wherein X represents the peel force of the first release sheet (1) from the pressure sensitive adhesive layer (3), mN/20 mm; and Y represents the peel force of the second release sheet (2) from the pressure sensitive adhesive layer (3), mN/20 mm, and the pressure sensitive adhesive layer (3), the first release agent layer (11), and the second release agent layer (21) are substantially free from a silicone compound and a halogen compound.</p> |