BOARD ON CHIP PLATE AND BOARD ON CHIP PACKAGE HAVING THE SAME

摘要

PURPOSE: A board on chip plate and a board on chip package having the same are provided to prevent short between lead fingers by preventing sweeping phenomenon caused by viscosity of molding material. CONSTITUTION: A conductive pad is formed on a single-side of a circuit board(100). A lead(104) is electrically connected to pad. A first lead finger(106a) is formed in one end of the lead. The first lead finger connects with the bonding wire(140) for the semiconductor chip arranged in substrate and wire bonding. It leaves the first lead finger and level difference and the second lead finger(106b) is formed.