| 摘要 |
Epoxide resins are prepared by reacting at 20-120 DEG C. with 1-15 mols of halohydrin, a compound of formula <FORM:1002457/C3/1> wherein R and R1 are each Me, Et, MeO, EtO, Cl, Br, I or F; m and p are each 0 or 1; n is 0, 1 or 2 and the bonds shown projecting into the benzene rings can be attached in one of the positions (a), (b) and (c). In examples, the above compound (m=p=0, n=2, position (b) attachment) is reacted with epichlorohydric; a list of other suitable halohydrins is given. The epoxide resins may be cured by conventional acidic and basic hardening agents and plasticized by dibutylphthalate and a urea-formaldehyde resin.ALSO:The invention comprises a compound of formula <FORM:1002457/C2/1> wherein R and R1 are each Me, Et, MeO, EtO, Cl, Br, I or F; m and p are each 0 or 1; n is 0, 1 or 2 and the bonds shown projecting into the benzene rings can be attached in one of the positions (a), (b) and (c). Such compound is prepared by reacting at 30-200 DEG C. in presence of an acid-activated siliceous catalyst m- or p-diisopropylbenzene-a ,a 1-diol (1 mol) with phenol which is optionally ortho-substituted by R and R1 (0.5-4 mols). Examples describe the reaction with unsubstituted phenol. |
