发明名称 METHOD FOR CLEANING WAFER
摘要 PURPOSE: A substrate cleansing method is provided to increase the number of processing substrates by processing a substrate consecutively after treating a substrate in DHF(Dilute Hydrofluoric Acid) process and pre-heating. CONSTITUTION: A substrate is processed in the DHF(Dilute Hydrofluoric Acid)(S10). The substrate processed the DHF(Dilute Hydrofluoric Acid) is preheated(S20). The preheated substrate as described above is processed the SPM(Sulfuric Peroxide Mixture)(S30). The substrate processed SPM is processed the APM(Ammonium Peroxide Mixture)(S40).
申请公布号 KR20100045738(A) 申请公布日期 2010.05.04
申请号 KR20080104822 申请日期 2008.10.24
申请人 SEMES CO., LTD. 发明人 KIM, YI JUNG
分类号 H01L21/302 主分类号 H01L21/302
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