发明名称 |
Shielding film, shielded printed circuit board, shielded flexible printed circuit board, method of manufacturing shielding film, and method of manufacturing shielded printed circuit board |
摘要 |
The invention includes a shielding film, which does not have breakage of a metal layer, and has excellent abrasion resistance and blocking resistance, and does not crack. The cover film 7 is provided on one surface of a separation film 6a, and an adhesive layer 8a is formed on the surface of the cover film 7 opposite to the separation film 6a via the metal layer. The cover film 7 has at least one hard layer 7a and at least one soft layer 7b, and the surface of the cover film 7 facing the separation film 6a is composed of the hard layer 7a.
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申请公布号 |
US7709750(B2) |
申请公布日期 |
2010.05.04 |
申请号 |
US20060914291 |
申请日期 |
2006.05.10 |
申请人 |
TATSUTA SYSTEM ELECTRONICS CO, LTD.;NIPPON MEKTRON, LTD. |
发明人 |
HASHIMOTO KAZUHIRO;MORIMOTO SYOHEI;KAWAKAMI YOSHINORI;KAMINO KENJI;EBIHARA SATOSHI;TANAKA HIDEAKI;AKATSUKA TAKAHISA |
分类号 |
H05K9/00 |
主分类号 |
H05K9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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