发明名称 Shielding film, shielded printed circuit board, shielded flexible printed circuit board, method of manufacturing shielding film, and method of manufacturing shielded printed circuit board
摘要 The invention includes a shielding film, which does not have breakage of a metal layer, and has excellent abrasion resistance and blocking resistance, and does not crack. The cover film 7 is provided on one surface of a separation film 6a, and an adhesive layer 8a is formed on the surface of the cover film 7 opposite to the separation film 6a via the metal layer. The cover film 7 has at least one hard layer 7a and at least one soft layer 7b, and the surface of the cover film 7 facing the separation film 6a is composed of the hard layer 7a.
申请公布号 US7709750(B2) 申请公布日期 2010.05.04
申请号 US20060914291 申请日期 2006.05.10
申请人 TATSUTA SYSTEM ELECTRONICS CO, LTD.;NIPPON MEKTRON, LTD. 发明人 HASHIMOTO KAZUHIRO;MORIMOTO SYOHEI;KAWAKAMI YOSHINORI;KAMINO KENJI;EBIHARA SATOSHI;TANAKA HIDEAKI;AKATSUKA TAKAHISA
分类号 H05K9/00 主分类号 H05K9/00
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