| 摘要 |
A semiconductor package module having a heat dissipation device includes one or more semiconductor packages with each semiconductor package having semiconductor chips and solder balls connected to the semiconductor chips. A printed circuit board is electrically connected to each of the semiconductor packages. The heat dissipation device dissipates heat generated within the semiconductor package module and includes a fastening member having a fastening body. The fastening member is placed in the space between the semiconductor chips and the printed circuit board, which occurs due to the presence of the solder balls. A coupling groove is defined in an upper surface of the fastening body, and a heat dissipation member covers the semiconductor packages. A through-hole is defined in the heat dissipation member at a position corresponding to the coupling groove, and a coupling member is disposed within the through-hole and is coupled to the coupling groove. |
