<p>PURPOSE: A semiconductor package device is provided to prevent short-circuit between leads by combining an exposure direction of a lead in one direction. CONSTITUTION: At least one first semiconductor chip(1) is provided. At least one second semiconductor chip(2) is located in the lower direction of the first semiconductor chip. A sealant(3) protects the first semiconductor chip and the second semiconductor chip. One end of the first lead(11) is electrically connected to the first semiconductor chip. The other end part of the first lead is exposed to the outside of the sealant. A second lead(12) is electrically connected to the second semiconductor chip.</p>
