HEAD ASSEMBLY AND CHIP MOUNTER HAVING THE SAME

摘要

PURPOSE: A head assembly and a chip mounter including the same are provided to absorb a plurality of electronic components with one head body by arranging spindles, which vertically move, on the head body. CONSTITUTION: A plurality of spindles(420) is arranged on a head body(410). The spindles are arranged to be vertically moved. An operation unit(430) is arranged on the upper side of the spindles. A transfer unit(440) is arranged on the head body. The transfer unit receives electrical signal from the outside and moves the operation part. A control unit(450) transmits the operation unit and the transfer unit in order to control the operation of the spindles.