RESINE COMPOSITION AND PREPREG AND PRINTED WIRING BOARD USING THE SAME

摘要

PURPOSE: A resin composition capable of producing a pre-preg, a pre-preg using thereof, and a printed wiring board using thereof are provided to prevent a dust from being generated during punching or blanking a flexible print wiring board. CONSTITUTION: A resin composition capable of producing a pre-preg contains the following: 50~100 parts by weight of halogen-free epoxy resin including more than two epoxy groups; 5~30 parts by weight of transformed phosphorus copolymers selected from the group consisting of butadiene acrylonitrile modified phosphate-based epoxy copolymer terminated with a carboxyl group, and nitrilbutadiene rubber transformed phosphorus copolymers; 30~100 parts by weight of inorganic filler; and 10~40 parts by weight of hardener.