SOLDER PASTE FOR SOLDERING TO CIRCUIT BOARD, AND CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a solder paste having excellent wettability of a molten solder to a lead and an electrode subjected to the lead-free solder plating, excellent wettability of molten solder to a metal surface of a circuit board, and excellent electric insulation by effectively preventing corrosion of a soldering land. SOLUTION: The solder paste to be used when soldering an electric component to a circuit board is provided. The solder paste contains a flux for soldering the circuit board and a solder powder. The flux contains halogenated organic acid having halogen atom and carboxylic group. COPYRIGHT: (C)2010,JPO&INPIT