| 摘要 |
PROBLEM TO BE SOLVED: To provide a joining device capable of suppressing artificial determination mistakes while facilitating selection of a component having a high heat resisting condition, and further showing a heat resisting condition (time or temperature) which is lacking in the stage of component selection to a component maker as a quantitative numerical value, and to provide a heat resistance diagnostic method and a heat resistance diagnostic program for the component. SOLUTION: The joining device includes: a determination part which determines whether heat resistance rank data of a component to be mounted on a printed wiring board is matched to heat resistance rank data based on the reflow temperature condition of the printed wiring board; and a heat resistance diagnostic part which gives, when the heat resistance rank data of the component is not matched to the heat resistance rank data of the printed wiring board, heat resistance rank data of the component by use of the reflow temperature condition of a recommendation reflow profile of the component. COPYRIGHT: (C)2010,JPO&INPIT |
